IEC TS 62610-1:2009
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
1) cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet;
2) cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet;
3) cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.
|Publication type||Technical Specification|
|TC/SC||TC 48/SC 48D - Mechanical structures for electronic equipmentrss|
|ICS||31.240 - Mechanical structures for electronic equipment|
|File size||3286 KB|
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